Sumin Kim
Sumin Kim
Department of Architecture & Architectural Engineering, Yonsei University의 이메일 확인됨 - 홈페이지
High latent heat storage and high thermal conductive phase change materials using exfoliated graphite nanoplatelets
S Kim, LT Drzal
Solar Energy Materials and Solar Cells 93 (1), 136-142, 2009
The effect of types of maleic anhydride-grafted polypropylene (MAPP) on the interfacial adhesion properties of bio-flour-filled polypropylene composites
HS Kim, BH Lee, SW Choi, S Kim, HJ Kim
Composites Part A: Applied Science and Manufacturing 38 (6), 1473-1482, 2007
Thermal properties of bio-flour-filled polyolefin composites with different compatibilizing agent type and content
HS Kim, S Kim, HJ Kim, HS Yang
Thermochimica acta 451 (1-2), 181-188, 2006
Thermogravimetric analysis of rice husk flour filled thermoplastic polymer composites
HS Kim, HS Yang, HJ Kim, HJ Park
Journal of thermal analysis and calorimetry 76 (2), 395-404, 2004
Bio-composites of kenaf fibers in polylactide: Role of improved interfacial adhesion in the carding process
BH Lee, HS Kim, S Lee, HJ Kim, JR Dorgan
Composites Science and Technology 69 (15-16), 2573-2579, 2009
Effect of different compatibilizing agents on the mechanical properties of lignocellulosic material filled polyethylene bio-composites
HS Yang, MP Wolcott, HS Kim, S Kim, HJ Kim
Composite Structures 79 (3), 369-375, 2007
Environment-friendly adhesives for surface bonding of wood-based flooring using natural tannin to reduce formaldehyde and TVOC emission
S Kim
Bioresource technology 100 (2), 744-748, 2009
Biodegradability and mechanical properties of agro‐flour–filled polybutylene succinate biocomposites
HS Kim, HS Yang, HJ Kim
Journal of Applied Polymer Science 97 (4), 1513-1521, 2005
Building materials thermal conductivity measurement and correlation with heat flow meter, laser flash analysis and TCi
J Cha, J Seo, S Kim
Journal of thermal analysis and calorimetry 109 (1), 295-300, 2012
Effect of addition of polyvinyl acetate to melamine-formaldehyde resin on the adhesion and formaldehyde emission in engineered flooring
S Kim, HJ Kim
International Journal of Adhesion and Adhesives 25 (5), 456-461, 2005
Comparison of standard methods and gas chromatography method in determination of formaldehyde emission from MDF bonded with formaldehyde-based resins
S Kim, HJ Kim
Bioresource Technology 96 (13), 1457-1464, 2005
Application of PCM thermal energy storage system to reduce building energy consumption
J Jeon, JH Lee, J Seo, SG Jeong, S Kim
Journal of thermal analysis and calorimetry 111 (1), 279-288, 2013
Properties of lignocellulosic material filled polypropylene bio-composites made with different manufacturing processes
HS Yang, MP Wolcott, HS Kim, S Kim, HJ Kim
Polymer Testing 25 (5), 668-676, 2006
Comparison of formaldehyde emission from building finishing materials at various temperatures in under heating system; ONDOL
S Kim, HJ Kim
Indoor Air 15 (5), 317-325, 2005
Preparation of energy efficient paraffinic PCMs/expanded vermiculite and perlite composites for energy saving in buildings
O Chung, SG Jeong, S Kim
Solar Energy Materials and Solar Cells 137, 107-112, 2015
Optimal preparation of PCM/diatomite composites for enhancing thermal properties
SG Jeong, J Jeon, JH Lee, S Kim
International Journal of Heat and Mass Transfer 62, 711-717, 2013
Bio-based PCM/carbon nanomaterials composites with enhanced thermal conductivity
S Yu, SG Jeong, O Chung, S Kim
Solar Energy Materials and Solar Cells 120, 549-554, 2014
Curing behavior and viscoelastic properties of pine and wattle tannin-based adhesives studied by dynamic mechanical thermal analysis and FT-IR-ATR spectroscopy
S Kim, HJ Kim
Journal of adhesion science and technology 17 (10), 1369-1383, 2003
Improvement of the thermal properties of Bio-based PCM using exfoliated graphite nanoplatelets
SG Jeong, O Chung, S Yu, S Kim, S Kim
Solar Energy Materials and Solar Cells 117, 87-92, 2013
Multifunctional xGnP/LLDPE nanocomposites prepared by solution compounding using various screw rotating systems
S Kim, I Do, LT Drzal
Macromolecular Materials and Engineering 294 (3), 196-205, 2009
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학술자료 1–20