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Co-authors
- Fei LuUniversity of California RiversideVerified email at ucr.edu
- Zongyu DongQualcomm Technology IncVerified email at ucr.edu
- Mau-Chung Frank ChangUniversity of California, Los AngelesVerified email at ee.ucla.edu
- C. Patrick Yue, PhD, IEEE Fellow, Opti...Professor of ECE & Director of HKUST IC Design Center (ICDC) & Optical Wireless Lab (OWL)Verified email at ust.hk
- Rui MaAnalog Engineer, IntelVerified email at intel.com
- Qi ChenElectrical Engineering, University of California, RiversideVerified email at ucr.edu
- YUAN DUNanjing UniversityVerified email at nju.edu.cn
- Xin WangOmniVision Technologies Inc. (PhD.EE @ University of California Riverside)Verified email at ucr.edu
- Chien-Heng WongUCLAVerified email at ucla.edu
- He TangProfessor of Microelectronics, Unniv. of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
- Li SunPrincipal Engineer at MarvellVerified email at marvell.com
- Ya-Hong XieUniversity of California Los Angeles, Materials Sciences & EngineeringVerified email at ucla.edu
- LiangXu WangCold and Arid Regions Environmental and Engineering Research Institute, Chinese Academy of SciencesVerified email at lzb.ac.cn