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Robert O'Connor
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Ubiquitous relaxation in BTI stressing—New evaluation and insights
B Kaczer, T Grasser, J Roussel, J Martin-Martinez, R O'Connor, ...
2008 IEEE International Reliability Physics Symposium, 20-27, 2008
2952008
Simultaneous extraction of recoverable and permanent components contributing to bias-temperature instability
T Grasser, B Kaczer, P Hehenberger, W Gos, R O'Connor, H Reisinger, ...
2007 IEEE International Electron Devices Meeting, 801-804, 2007
1502007
Recyclability of stainless steel (316 L) powder within the additive manufacturing process
NE Gorji, R O'Connor, A Mussatto, M Snelgrove, PGM González, ...
Materialia 8, 100489, 2019
702019
Implications of progressive wear-out for lifetime extrapolation of ultra-thin (EOT~ 1nm) SiON films
B Kaczer, R Degraeve, R O'Connor, P Roussel, G Groeseneken
IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2004, TECHNICAL DIGEST, 713-716, 2004
532004
A new method for assessing the recyclability of powders within Powder Bed Fusion process
NE Gorji, P Saxena, M Corfield, A Clare, JP Rueff, J Bogan, ...
Materials Characterization 161, 110167, 2020
522020
Comprehensive assessment of spatter material generated during selective laser melting of stainless steel
MA Obeidi, A Mussatto, R Groarke, RK Vijayaraghavan, A Conway, ...
Materials Today Communications 25, 101294, 2020
422020
Tuning of oxygen vacancy-induced electrical conductivity in Ti-doped hematite films and its impact on photoelectrochemical water splitting
P Biswas, A Ainabayev, A Zhussupbekova, F Jose, R O’connor, A Kaisha, ...
Scientific Reports 10 (1), 7463, 2020
362020
SILC defect generation spectroscopy in HfSiON using constant voltage stress and substrate hot electron injection
R O'Connor, L Pantisano, R Degraeve, T Kauerauf, B Kaczer, PJ Roussel, ...
2008 IEEE International Reliability Physics Symposium, 324-329, 2008
322008
Area-selective ALD of Ru on nanometer-scale Cu lines through dimerization of amino-functionalized alkoxy silane passivation films
I Zyulkov, V Madhiwala, E Voronina, M Snelgrove, J Bogan, R O’Connor, ...
ACS applied materials & interfaces 12 (4), 4678-4688, 2020
302020
X-ray tomography, AFM and nanoindentation measurements for recyclability analysis of 316L powders in 3D printing process
NE Gorji, R O’Connor, D Brabazon
Procedia Manufacturing 47, 1113-1116, 2020
302020
Methodologies for sub-1nm EOT TDDB evaluation
T Kauerauf, R Degraeve, LĹ Ragnarsson, P Roussel, S Sahhaf, ...
2011 International Reliability Physics Symposium, 2A. 2.1-2A. 2.10, 2011
292011
On the use of (3-trimethoxysilylpropyl) diethylenetriamine self-assembled monolayers as seed layers for the growth of Mn based copper diffusion barrier layers
A Brady-Boyd, R O’Connor, S Armini, V Selvaraju, G Hughes, J Bogan
Applied Surface Science 427, 260-266, 2018
272018
XPS, XRD, and SEM characterization of the virgin and recycled metallic powders for 3D printing applications
NE Gorji, R O’Connor, D Brabazon
IOP Conference Series: Materials Science and Engineering 591 (1), 012016, 2019
262019
XPS, SEM, AFM, and nano-indentation characterization for powder recycling within additive manufacturing process
NE Gorji, R O’connor, D Brabazon
IOP Conference Series: Materials Science and Engineering 1182 (1), 012025, 2021
242021
Photoemission study of the identification of Mn silicate barrier formation on carbon containing low-κ dielectrics
J Bogan, AP McCoy, R O’Connor, P Casey, C Byrne, G Hughes
Microelectronic engineering 130, 46-51, 2014
212014
Degradation and breakdown characteristics of thin MgO dielectric layers
R O’Connor, G Hughes, P Casey, SB Newcomb
Journal of Applied Physics 107 (2), 2010
212010
Analysing trimethylaluminum infiltration into polymer brushes using a scalable area selective vapor phase process
M Snelgrove, C McFeely, K Shiel, G Hughes, P Yadav, C Weiland, ...
Materials Advances 2 (2), 769-781, 2021
202021
Hard x-ray photoelectron spectroscopy study of copper formation by metal salt inclusion in a polymer film
M Snelgrove, PG Mani-González, J Bogan, R Lundy, JP Rueff, G Hughes, ...
Journal of Physics D: Applied Physics 52 (43), 435301, 2019
202019
Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers
J Bogan, A Brady-Boyd, S Armini, R Lundy, V Selvaraju, R O'Connor
Applied Surface Science 462, 38-47, 2018
202018
Reliability of HfSiON gate dielectrics
R O'Connor, G Hughes, R Degraeve, B Kaczer, T Kauerauf
Semiconductor science and technology 20 (1), 68, 2004
192004
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