| Prediction of abrasive and impact wear due to multi-shaped particles in a centrifugal pump via CFD-DEM coupling method C Tang, YC Yang, PZ Liu, YJ Kim Energies 14 (9), 2391, 2021 | 17 | 2021 |
| Investigation of thermal effects in copper chemical mechanical polishing P Liu, S Bae, S Hong, C Bae, H Seo, J Lee, C Tang, T Kim Precision Engineering 73, 195-202, 2022 | 12 | 2022 |
| Communication—effect of hydrogen water on ceria abrasive removal in post-CMP cleaning S Hong, SH Park, C Kanade, J Lee, P Liu, I Lee, H Seok, T Kim ECS Journal of Solid State Science and Technology 9 (4), 044012, 2020 | 9 | 2020 |
| Investigation of abrasive behavior between pad asperity and oxide thin film in chemical mechanical planarization S Jeon, J Lee, S Hong, H Seo, Y Cho, P Liu, K Park, T Kim Materials Science in Semiconductor Processing 138, 106280, 2022 | 8 | 2022 |
| The mechanical effect of soft pad on copper chemical mechanical polishing P Liu, Y Nam, S Lee, E Kim, S Jeon, K Park, S Hong, T Kim Materials Science in Semiconductor Processing 155, 107256, 2023 | 6 | 2023 |
| Polishing of zirconia ceramics by chemically-induced micro-nano bubbles L Xu, K Park, H Lei, C Yao, V Kanade, E Kim, C Kanade, P Liu, T Kim Ceramics International 48 (12), 17185-17195, 2022 | 6 | 2022 |
| Auxiliary mechanism of in-situ micro-nano bubbles in oxide chemical mechanical polishing L Xu, P Liu, H Lei, K Park, E Kim, Y Cho, J Lee, S Park, T Kim Precision Engineering 74, 20-35, 2022 | 6 | 2022 |
| A numerical study on slurry flow with CMP pad grooves S Hong, S Bae, S Choi, P Liu, H Kim, T Kim Microelectronic Engineering 234, 111437, 2020 | 6 | 2020 |
| Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments L Xu, K Park, H Lei, P Liu, E Kim, Y Cho, T Kim, C Chen Friction 11 (9), 1624-1640, 2023 | 5 | 2023 |
| Simulation and experimental investigation of the radial groove effect on slurry flow in oxide chemical mechanical polishing Y Cho, P Liu, S Jeon, J Lee, S Bae, S Hong, YH Kim, T Kim Applied Sciences 12 (9), 4339, 2022 | 5 | 2022 |
| Investigations of the pad trajectory effect on the asymmetric profile and arc-shaped scratches in chemical mechanical polishing K Hwang, K Seo, Y Kwon, J Lim, H Moon, I Jang, K Park, P Liu, T Kim ECS Journal of Solid State Science and Technology 10 (7), 074005, 2021 | 4 | 2021 |
| Tangential flow filtration of ceria slurry: Application of a single-pass method to improve buff cleaning J Lee, H Seo, SH Park, E Kim, J Lee, P Liu, S Jeon, S Hong, T Kim Materials Science in Semiconductor Processing 145, 106618, 2022 | 3 | 2022 |
| Investigations on the mechanism of silica particle removal during the Cu buff cleaning process P Liu, S Hong, S Jeon, J Lee, D Kwak, Y Wada, H Hiyama, S Hamada, ... Colloids and Surfaces A: Physicochemical and Engineering Aspects 627, 127156, 2021 | 3 | 2021 |
| Study on Abnormally Accelerated Oxidation of Tungsten Plugs during Tungsten Chemical Mechanical Polishing in Semiconductor Manufacturing K Hwang, Y Jeon, S Hong, P Liu, T Kim ECS Journal of Solid State Science and Technology 10 (6), 064012, 2021 | 3 | 2021 |
| Application of an Electrical Low Pressure Impactor (ELPI) for Residual Particle Measurement in an Epitaxial Growth Reactor S Lee, D Kim, Y Cho, E Kim, P Liu, DB Kwak, S Keum, H Lim, T Kim Applied Sciences 11 (16), 7680, 2021 | 2 | 2021 |
| Communication—A Novel Method to Improve Cleaning Performance by Removing Small Particles in CMP Slurry J Lee, SH Park, S Hong, H Seo, P Liu, E Kim, T Kim ECS Journal of Solid State Science and Technology 10 (2), 024001, 2021 | 2 | 2021 |
| Environmentally friendly buff cleaning of ceria nanoparticles using bubbles in gas-dissolved water P Liu, Y Nam, S Jeon, C Kim, E Kim, S Choi, S Lee, SH Park, S Hong, ... Colloids and Surfaces A: Physicochemical and Engineering Aspects 671, 131558, 2023 | 1 | 2023 |
| Effects of Gas Dissolved Water for Ceria Nanoparticles on the SiO2 Film Surface in Post-CMP Cleaning K Park, W Jeon, P Liu, S Jeon, S Park, T Kim 245th ECS Meeting (May 26-30, 2024), 2024 | | 2024 |
| Investigation of Polisher Head and Slurry Sweep Effect in Oxide Film Polishing P Liu, C Kang, K Park, S Jeon, Z Wang, H Lee, H Jeong, E Lee, T Kim ECS Journal of Solid State Science and Technology 13 (4), 044004, 2024 | | 2024 |
| Development of Novel Conditioning Method Using Thermal Shape Memory Characteristics of Polyurethane CMP Pad J Seo, S Jeon, J Yoon, J An, Y Choi, H Seok, S Lee, P Liu, W Jeon, T Kim Journal of Solid State Science and Technology 13 (3), 034003, 2024 | | 2024 |
