| X-ray photoelectron spectroscopic studies of surface modified single-walled carbon nanotube material WH Lee, SJ Kim, WJ Lee, JG Lee, RC Haddon, PJ Reucroft Applied surface science 181 (1-2), 121-127, 2001 | 178 | 2001 |
| Graphene synthesis on Fe foil using thermal CVD H An, WJ Lee, J Jung Current Applied Physics 11 (4), S81-S85, 2011 | 149 | 2011 |
| Sensing behavior and mechanism of mixed potential NO x sensors using NiO, NiO (+ YSZ) and CuO oxide electrodes J Park, BY Yoon, CO Park, WJ Lee, CB Lee Sensors and Actuators B: Chemical 135 (2), 516-523, 2009 | 136 | 2009 |
| Adhesion and interface chemical reactions of Cu/polyimide and Cu/TiN by XPS WJ Lee, YS Lee, SK Rha, YJ Lee, KY Lim, YD Chung, CN Whang Applied Surface Science 205 (1-4), 128-136, 2003 | 116 | 2003 |
| Improved TiN film as a diffusion barrier between copper and silicon SK Rha, WJ Lee, SY Lee, YS Hwang, YJ Lee, DI Kim, DW Kim, SS Chun, ... Thin Solid Films 320 (1), 134-140, 1998 | 100 | 1998 |
| A comparative study on the Si precursors for the atomic layer deposition of silicon nitride thin films WJ Lee, JH Lee, CO Park, YS Lee, SJ Shin, SK Rha Journal of the Korean Physical Society 45 (5), 1352-1355, 2004 | 77 | 2004 |
| Growth studies and characterization of silicon nitride thin films deposited by alternating exposures to Si 2 Cl 6 and NH 3 K Park, WD Yun, BJ Choi, HD Kim, WJ Lee, SK Rha, CO Park Thin Solid Films 517 (14), 3975-3978, 2009 | 72 | 2009 |
| Plasma-Enhanced Atomic Layer Deposition of Silicon Nitride Using a Novel Silylamine Precursor JM Park, SJ Jang, LL Yusup, WJ Lee, SI Lee ACS Applied Materials & Interfaces 8 (32), 20865-20871, 2016 | 67 | 2016 |
| Investigation of silicon oxide thin films prepared by atomic layer deposition using SiH2Cl2 and O3 as the precursors JH Lee, UJ Kim, CH Han, SK Rha, WJ Lee, CO Park Japanese journal of applied physics 43 (3A), L328, 2004 | 62 | 2004 |
| Reactivity of different surface sites with silicon chlorides during atomic layer deposition of silicon nitride LL Yusup, JM Park, YH Noh, SJ Kim, WJ Lee, S Park, YK Kwon RSC Advances 6 (72), 68515-68524, 2016 | 46 | 2016 |
| Atomic layer deposition of silicon oxide thin films by alternating exposures to Si2Cl6 and O3 SW Lee, K Park, B Han, SH Son, SK Rha, CO Park, WJ Lee Electrochemical and Solid State Letters 11 (7), G23, 2008 | 43 | 2008 |
| Characterization of TiN barriers against Cu diffusion by capacitance–voltage measurement SK Rha, SY Lee, WJ Lee, YS Hwang, CO Park, DW Kim, YS Lee, ... Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 1998 | 43 | 1998 |
| Characteristics of silicon nitride thin films prepared by using alternating exposures of SiH2Cl2 and NH3 WJ LEE, UJ KIM, CH HAN, MH CHUN, SK RHA, YS LEE Journal of the Korean Physical Society 47, S598-S602, 2005 | 40 | 2005 |
| Preparation of nanocrystalline nickel oxide-yttria-stabilized zirconia composite powder by solution combustion with ignition of glycine fuel SJ Kim, W Lee, WJ Lee, SD Park, JS Song, EG Lee Journal of Materials Research 16 (12), 3621-3627, 2001 | 38 | 2001 |
| Low-temperature atomic layer deposition of cobalt oxide thin films using dicobalt hexacarbonyl tert-butylacetylene and ozone B Han, KH Choi, K Park, WS Han, WJ Lee Electrochemical and Solid State Letters 15 (2), D14, 2011 | 37 | 2011 |
| Copper chemical vapour deposition using copper (I) hexafluoroacetylacetonate trimethylvinylsilane WJ Lee, JS Min, SK Rha, SS Chun, CO Park, DW Kim Journal of Materials Science: Materials in Electronics 7, 111-117, 1996 | 37 | 1996 |
| Atomic layer deposition of copper nitride film and its application to copper seed layer for electrodeposition JM Park, K Jin, B Han, MJ Kim, J Jung, JJ Kim, WJ Lee Thin Solid Films 556, 434-439, 2014 | 36 | 2014 |
| Surface reaction of silicon chlorides during atomic layer deposition of silicon nitride LL Yusup, JM Park, TR Mayangsari, YK Kwon, WJ Lee Applied Surface Science 432, 127-131, 2018 | 30 | 2018 |
| Novel Cyclosilazane-Type Silicon Precursor and Two-Step Plasma for Plasma-Enhanced Atomic Layer Deposition of Silicon Nitride JM Park, SJ Jang, SI Lee, WJ Lee ACS applied materials & interfaces 10 (10), 9155-9163, 2018 | 30 | 2018 |
| Interdiffusions and reactions in Cu/TiN/Ti/Si and Cu/TiN/Ti/SiO2/Si multilayer structures SK Rha, WJ Lee, SY Lee, DW Kim, CO Park, SS Chun Journal of materials research 12 (12), 3367-3372, 1997 | 30 | 1997 |
Chong ook ParkKAISTVerified email at kaist.ac.kr
