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Desmond Y.R. Chong
Desmond Y.R. Chong
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Drop impact reliability testing for lead-free and lead-based soldered IC packages
DYR Chong, FX Che, JHL Pang, K Ng, JYN Tan, PTH Low
Microelectronics reliability 46 (7), 1160-1171, 2006
2182006
Thermal cycling analysis of flip-chip solder joint reliability
JHL Pang, DYR Chong, TH Low
IEEE Transactions on components and packaging technologies 24 (4), 705-712, 2001
2122001
Analysis of bone–prosthesis interface micromotion for cementless tibial prosthesis fixation and the influence of loading conditions
DYR Chong, UN Hansen, AA Amis
Journal of biomechanics 43 (6), 1074-1080, 2010
1202010
Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models
JHL Pang, DYR Chong
IEEE Transactions on Advanced Packaging 24 (4), 499-506, 2001
1192001
Mechanical characterization in failure strength of silicon dice
DYR Chong, WE Lee, BK Lim, JHL Pang, TH Low
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2004
812004
Medial longitudinal arch biomechanics evaluation during gait in subjects with flexible flatfoot
T Prachgosin, DYR Chong, W Leelasamran, P Smithmaitrie, S Chatpun
Acta of bioengineering and biomechanics 17 (4), 121--130, 2015
732015
The influence of tibial component fixation techniques on resorption of supporting bone stock after total knee replacement
DYR Chong, UN Hansen, R Van der Venne, N Verdonschot, AA Amis
Journal of Biomechanics 44 (5), 948-954, 2011
722011
Finite element analysis of bone and implant stresses for customized 3D-printed orthopaedic implants in fracture fixation
L Yan, JL Lim, JW Lee, CSH Tia, GK O’Neill, DYR Chong
Medical & biological engineering & computing 58, 921-931, 2020
422020
The influence of bilateral sagittal split ramus osteotomy on the stress distributions in the temporomandibular joints of the patients with facial asymmetry under symmetric …
JH Shu, J Yao, YL Zhang, DYR Chong, Z Liu
Medicine 97 (25), e11204, 2018
392018
Drop test reliability assessment of leaded & lead-free solder joints for IC packages
DYR Chong, K Ng, JYN Tan, PTH Low, JHL Pang, FX Che
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004 …, 2004
342004
Biomechanical behaviour of temporomandibular joints during opening and closing of the mouth: a 3D finite element analysis
J Shu, H Ma, L Jia, H Fang, DYR Chong, T Zheng, J Yao, Z Liu
International Journal for Numerical Methods in Biomedical Engineering 36 (8 …, 2020
322020
Development of a new improved high performance flip chip BGA package
DYR Chong, BK Lim, KJ Rebibis, SJ Pan, S Krishnamoorthi, R Kapoor, ...
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
302004
Evaluation on influencing factors of board-level drop reliability for chip scale packages (fine-pitch ball grid array)
DYR Chong, FX Che, JHL Pang, L Xu, BS Xiong, HJ Toh, BK Lim
IEEE Transactions on Advanced Packaging 31 (1), 66-75, 2008
272008
Performance assessment on board-level drop reliability for chip scale packages (fine-pitch BGA)
DYR Chong, FX Che, LH Xu, HJ Toh, JHL Pang, BK Xiong, BK Lim
56th Electronic Components and Technology Conference 2006, 8 pp., 2006
272006
Effects on loads in temporomandibular joints for patients with mandibular asymmetry before and after orthognathic surgeries under the unilateral molar clenching
J Shu, Y Zhang, DYR Chong, Z Liu
Biomechanics and modeling in mechanobiology 19, 533-541, 2020
242020
Analysis of underfill encapsulation curing deformations on flip chip on board (FCOB) package reliability
JHL Pang, TI Tan, YR Chong, GY Lim, CL Wong
Journal of Electronics Manufacturing 8 (03n04), 181-191, 1998
241998
The influence of tibial prosthesis design features on stresses related to aseptic loosening and stress shielding
DYR Chong, UN Hansen, AA Amis
Journal of Mechanics in Medicine and Biology 11 (01), 55-72, 2011
222011
Drop reliability performance assessment for PCB assemblies of chip scale packages (CSP)
DYR Chong, HJ Toh, BK Lim, PTH Low, JHL Pang, FX Che, BS Xiong, ...
2005 7th Electronic Packaging Technology Conference 1, 8 pp., 2005
212005
Reliability assessment of a high performance flip-chip BGA package (organic substrate based) using finite element analysis
DYR Chong, R Kapoor, AYS Sun
TC 1, 4s-1, 2003
202003
A biomechanical study of proximal tibia bone grafting through the lateral approach
CT Lim, DQK Ng, KJ Tan, AK Ramruttun, W Wang, DYR Chong
Injury 47 (11), 2407-2414, 2016
192016
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