| Ortho-mode sub-THz interconnect channel for planar chip-to-chip communications B Yu, Y Ye, X Ding, Y Liu, Z Xu, X Liu, QJ Gu IEEE Transactions on Microwave Theory and Techniques 66 (4), 1864-1873, 2017 | 45 | 2017 |
| A high-efficiency GaAs MMIC power amplifier for multi-standard system X Ding, L Zhang IEEE Microwave and Wireless Components Letters 26 (1), 55-57, 2016 | 42 | 2016 |
| 2–4 GHz wideband power amplifier with ultra‐flat gain and high PAE X Ding, S He, F You, S Xie, Z Hu Electronics Letters 49 (5), 326-327, 2013 | 38 | 2013 |
| High energy-efficiency high bandwidth-density sub-THz interconnect for the “Last-Centimeter” chip-to-chip communications Y Ye, B Yu, X Ding, X Liu, QJ Gu 2017 IEEE MTT-S International Microwave Symposium (IMS), 2017 | 14 | 2017 |
| THz interconnect for inter-/intra-chip communication QJ Gu, B Yu, X Ding, Y Ye, X Liu, Z Xu Micro-and Nanotechnology Sensors, Systems, and Applications XI 10982, 452-459, 2019 | 10 | 2019 |
| Ring-resonator-based sub-THz dielectric sensor B Yu, X Ding, H Yu, Y Ye, X Liu, QJ Gu IEEE Microwave and Wireless Components Letters 28 (11), 969-971, 2018 | 10 | 2018 |
| Non‐fragile filtering for large‐scale power systems with sensor networks L Zhang, H Zhang, X Ding IET Generation, Transmission & Distribution 11 (4), 968-977, 2017 | 10 | 2017 |
| Dielectric waveguide based multi-mode sub-THz interconnect channel for high data-rate high bandwidth-density planar chip-to-chip communications B Yu, Y Ye, X Ding, Y Liu, X Liu, QJ Gu 2017 IEEE MTT-S International Microwave Symposium (IMS), 2017 | 10 | 2017 |
| Sub-THz interconnect for planar chip-to-chip communications B Yu, Y Ye, X Ding, C Neher, X Liu, Z Xu, QJ Gu 2018 IEEE 18th Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2018 | 9 | 2018 |
| A superharmonic injection based G-band quadrature VCO in CMOS X Ding, H Yu, B Yu, Z Xu, QJ Gu 2020 IEEE/MTT-S International Microwave Symposium (IMS), 345-348, 2020 | 8 | 2020 |
| Relative bioavailability risk assessment: a systematic approach to assessing in vivo risk associated with CM&C-related changes A Aburub, DC Sperry, S Bhattachar, E Lobo, X Ding, JP Rose Journal of Pharmaceutical Sciences 108 (1), 8-17, 2019 | 7 | 2019 |
| An FDD-based Full-Duplex Sub-THz Interconnect with Data-rate of 22.6 Gb/s and Energy-Efficiency of 1.58 pJ/bit X Ding, B Yu, Y Ye, H Yu, Z Xu, QJ Gu 2021 46th International Conference on Infrared, Millimeter and Terahertz …, 2021 | 5 | 2021 |
| An 8.3% efficiency 96–134 GHz CMOS frequency doubler using distributed amplifier and nonlinear transmission line S Hao, YW Tang, X Ding, L Du, Y Du, A Tang, QJ Gu, MCF Chang 2020 IEEE Asian Solid-State Circuits Conference (A-SSCC), 1-2, 2020 | 4 | 2020 |
| A 140 GHz, 4 dB Noise-Figure Low-Noise Amplifier Design with the Compensation of Parasitic Capacitance CGS D Wei, X Ding, H Yu, B Yu, S Ma, QJ Gu, J Ren 2019 IEEE 62nd International Midwest Symposium on Circuits and Systems …, 2019 | 4 | 2019 |
| Design and Analysis of a Mode-Coupler-Based Multimode Multidrop Si Dielectric Waveguide Channel for Sub-THz/THz Interconnect X Ding, H Yu, S Sabbaghi, QJ Gu IEEE Transactions on Microwave Theory and Techniques, 2023 | 3 | 2023 |
| A 1.6pJ/b 65Gb/s Si-Dielectric-Waveguide based Multi-Mode Multi-Drop sub-THz Interconnect in 65nm CMOS X Ding, H Yu, S Sabbaghi, QJ Gu 2023 IEEE Custom Integrated Circuits Conference (CICC), 1-2, 2023 | 2 | 2023 |
| G-band mode-coupler-based Si dielectric waveguide for multidrop sub-THz interconnect X Ding, H Yu, S Sabbaghi, QJ Gu IEEE Microwave and Wireless Technology Letters, 2023 | 2 | 2023 |
| Multiplexing Schemes for sub-THz/THz Interconnects X Ding, B Yu, H Yu, SS Saber, QJ Gu 2022 IEEE International Symposium on Radio-Frequency Integration Technology …, 2022 | 2 | 2022 |
| A 162 GHz ring resonator based high resolution dielectric sensor H Yu, B Yu, X Ding, JS Gómez-Díaz, QJ Gu 2020 IEEE/MTT-S International Microwave Symposium (IMS), 233-236, 2020 | 2 | 2020 |
| A CMOS 160GHz Integrated Permittivity Sensor with Resolution of 0.05% Δεr H Yu, X Ding, J Chen, SS Saber, QJ Gu 2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 245-248, 2023 | 1 | 2023 |
Qun Jane GuUniversity of California, DavisVerified email at ucdavis.edu
