HU HE (何虎)
HU HE (何虎)
Central South University (中南大学)
csu.edu.cn의 이메일 확인됨 - 홈페이지
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Quantifying multiscale habitat structural complexity: a cost-effective framework for underwater 3D modelling
R Ferrari, D McKinnon, H He, RN Smith, P Corke, M González-Rivero, ...
Remote Sensing 8 (2), 113, 2016
602016
The soft-landing features of a micro-magnetorheological fluid damper
J Li, W Wang, Y Xia, H He, W Zhu
Applied Physics Letters 106 (1), 014104, 2015
492015
Structural design and control of a small-MRF damper under 50 N soft-landing applications
J Li, D Wang, J Duan, H He, Y Xia, W Zhu
IEEE Transactions on Industrial Informatics 11 (3), 612-619, 2015
452015
Unaided stereo vision based pose estimation
M Warren, D McKinnon, H He, B Upcroft
382010
Nonparametric semantic segmentation for 3d street scenes
H He, B Upcroft
2013 IEEE/RSJ International Conference on Intelligent Robots and Systems …, 2013
362013
Dispensing of high concentration Ag nano-particles ink for ultra-low resistivity paper-based writing electronics
F Wang, P Mao, H He
Scientific reports 6, 21398, 2016
352016
Mosaicking of unmanned aerial vehicle imagery in the absence of camera poses
Y Xu, J Ou, H He, X Zhang, J Mills
Remote Sensing 8 (3), 204, 2016
342016
Towards automated and in-situ, near-real time 3-D reconstruction of coral reef environments
D McKinnon, H He, B Upcroft, RN Smith
OCEANS'11 MTS/IEEE KONA, 1-10, 2011
312011
Large scale monocular vision-only mapping from a fixed-wing sUAS
M Warren, D McKinnon, H He, A Glover, M Shiel, B Upcroft
302012
Monocular vision based autonomous navigation for a cost-effective MAV in GPS-denied environments
I Sa, H He, V Huynh, P Corke
2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics …, 2013
292013
An effective and efficient numerical method for thermal management in 3D stacked integrated circuits
C Xiao, H He, J Li, S Cao, W Zhu
Applied Thermal Engineering 121, 200-209, 2017
242017
Thermal conductivity of amorphous SiO 2 thin film: a molecular dynamics study
W Zhu, G Zheng, S Cao, H He
Scientific reports 8 (1), 1-9, 2018
232018
Effect of ultrasound on copper filling of high aspect ratio through-silicon via (TSV)
H Xiao, F Wang, Y Wang, H He, W Zhu
Journal of The Electrochemical Society 164 (4), D126, 2017
222017
Graphcut-based interactive segmentation using colour and depth cues
H He, D McKinnon, M Warren, B Upcroft
222010
Measuring reef complexity and rugosity from monocular video bathymetric reconstruction
H He, R Ferrari, D McKinnon, G Roff, R Smith, P Mumby, B Upcroft
Proceedings of the 12th International Coral Reef Symposium, 1-5, 2012
212012
Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging
Y Pan, F Li, H He, J Li, W Zhu
Microelectronics Reliability 70, 97-102, 2017
192017
Numerical modeling and experimental verification of copper electrodeposition for through silicon via (TSV) with additives
H Xiao, H He, X Ren, P Zeng, F Wang
Microelectronic Engineering 170, 54-58, 2017
132017
Numerical optimization on microchannel flow and heat transfer performance based on field synergy principle
F Li, W Zhu, H He
International Journal of Heat and Mass Transfer 130, 375-385, 2019
122019
Effects of applied potential and the initial gap between electrodes on localized electrochemical deposition of micrometer copper columns
F Wang, H Xiao, H He
Scientific reports 6, 26270, 2016
122016
Ultrasonic-assisted sintering of silver nanoparticles for flexible electronics
F Wang, N Nie, H He, Z Tang, Z Chen, W Zhu
The Journal of Physical Chemistry C 121 (51), 28515-28519, 2017
112017
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