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Ted S. Chung
Ted S. Chung
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Three-dimensional, multifunctional neural interfaces for cortical spheroids and engineered assembloids
Y Park, CK Franz, H Ryu, H Luan, KY Cotton, JU Kim, TS Chung, S Zhao, ...
Science Advances 7 (12), eabf9153, 2021
1472021
Three-dimensional electronic microfliers inspired by wind-dispersed seeds
BH Kim, K Li, JT Kim, Y Park, H Jang, X Wang, Z Xie, SM Won, HJ Yoon, ...
Nature 597 (7877), 503-510, 2021
1362021
An on-skin platform for wireless monitoring of flow rate, cumulative loss and temperature of sweat in real time
K Kwon, JU Kim, Y Deng, SR Krishnan, J Choi, H Jang, KH Lee, CJ Su, ...
Nature Electronics 4 (4), 302-312, 2021
1122021
Wireless, skin-interfaced sensors for compression therapy
Y Park, K Kwon, SS Kwak, DS Yang, JW Kwak, H Luan, TS Chung, ...
Science advances 6 (49), eabe1655, 2020
532020
Materials Chemistry of Neural Interface Technologies and Recent Advances in Three-Dimensional Systems
Y Park, TS Chung, G Lee, JA Rogers
Chemical Reviews 122 (5), 5277-5316, 2021
352021
Transparent, compliant 3D mesostructures for precise evaluation of mechanical characteristics of organoids
H Ryu, Y Park, H Luan, G Dalgin, K Jeffris, HJ Yoon, TS Chung, JU Kim, ...
Advanced Materials 33 (25), 2100026, 2021
282021
Three dimensional bioelectronic interfaces to small-scale biological systems
Y Park, TS Chung, JA Rogers
Current Opinion in Biotechnology 72, 1-7, 2021
122021
Ambipolar charge-transfer graphene plasmonic cavities
BSY Kim, AJ Sternbach, MS Choi, Z Sun, FL Ruta, Y Shao, AS McLeod, ...
Nature Materials, 1-6, 2023
92023
Wireless, Soft Sensors of Skin Hydration with Designs Optimized for Rapid, Accurate Diagnostics of Dermatological Health
J Shin, H Wang, K Kwon, D Ostojich, Z Christiansen, J Berkovich, Y Park, ...
Advanced healthcare materials 12 (4), 2202021, 2023
82023
Long-range Josephson coupling in T-MoTe/NbN junction arrays
T Chung, M Kreidel, J Balgley, E Arnault, X Chu, J Hone, KC Fong
Bulletin of the American Physical Society, 2024
2024
Superfluid Stiffness of Td-MoTe2 at Microwave Frequencies
M Kreidel, J Balgley, X Chu, T Chung, J Hone, R Westervelt, KC Fong
Bulletin of the American Physical Society, 2024
2024
Leveraging novel materials for quantum sensing
KC Fong, GH Lee, D Englund, J Hone, B Huang, E Arnault, W Jung, ...
Bulletin of the American Physical Society, 2024
2024
Soft, full Wheatstone bridge 3D pressure sensors for cardiovascular monitoring
Y Park, H Luan, K Kwon, TS Chung, S Oh, JY Yoo, G Chung, J Kim, S Kim, ...
npj Flexible Electronics 8 (1), 6, 2024
2024
3D Microstructures: Transparent, Compliant 3D Mesostructures for Precise Evaluation of Mechanical Characteristics of Organoids (Adv. Mater. 25/2021)
H Ryu, Y Park, H Luan, G Dalgin, K Jeffris, HJ Yoon, TS Chung, JU Kim, ...
Advanced Materials 33 (25), 2170196, 2021
2021
Three-Dimensional Electronic Microfliers With Designs Inspired by Wind-Dispersed Seeds
J Rogers, BH Kim, K Li, JT Kim, Y Park, H Jang, X Wang, Z Xie, S Won, ...
2021
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