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Ted S. Chung
Ted S. Chung
columbia.edu의 이메일 확인됨
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Three-dimensional, multifunctional neural interfaces for cortical spheroids and engineered assembloids
Y Park, CK Franz, H Ryu, H Luan, KY Cotton, JU Kim, TS Chung, S Zhao, ...
Science Advances 7 (12), eabf9153, 2021
402021
Three-dimensional electronic microfliers inspired by wind-dispersed seeds
BH Kim, K Li, JT Kim, Y Park, H Jang, X Wang, Z Xie, SM Won, HJ Yoon, ...
Nature 597 (7877), 503-510, 2021
322021
An on-skin platform for wireless monitoring of flow rate, cumulative loss and temperature of sweat in real time
K Kwon, JU Kim, Y Deng, SR Krishnan, J Choi, H Jang, KH Lee, CJ Su, ...
Nature Electronics 4 (4), 302-312, 2021
302021
Wireless, skin-interfaced sensors for compression therapy
Y Park, K Kwon, SS Kwak, DS Yang, JW Kwak, H Luan, TS Chung, ...
Science advances 6 (49), eabe1655, 2020
252020
Transparent, compliant 3D mesostructures for precise evaluation of mechanical characteristics of organoids
H Ryu, Y Park, H Luan, G Dalgin, K Jeffris, HJ Yoon, TS Chung, JU Kim, ...
Advanced Materials 33 (25), 2100026, 2021
112021
Three dimensional bioelectronic interfaces to small-scale biological systems
Y Park, TS Chung, JA Rogers
Current Opinion in Biotechnology 72, 1-7, 2021
32021
Materials Chemistry of Neural Interface Technologies and Recent Advances in Three-Dimensional Systems
Y Park, TS Chung, G Lee, JA Rogers
Chemical Reviews 122 (5), 5277-5316, 2021
12021
3D Microstructures: Transparent, Compliant 3D Mesostructures for Precise Evaluation of Mechanical Characteristics of Organoids (Adv. Mater. 25/2021)
H Ryu, Y Park, H Luan, G Dalgin, K Jeffris, HJ Yoon, TS Chung, JU Kim, ...
Advanced Materials 33 (25), 2170196, 2021
2021
Three-Dimensional Electronic Microfliers With Designs Inspired by Wind-Dispersed Seeds
J Rogers, BH Kim, K Li, JT Kim, Y Park, H Jang, X Wang, Z Xie, S Won, ...
2021
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