| Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials J Shim†, SH Bae†, W Kong†, D Lee†, K Qiao, D Nezich, YJ Park, R Zhao, ... Science 362 (6415), 665-670, 2018 | 265 | 2018 |
| Polarity governs atomic interaction through two-dimensional materials W Kong, H Li, K Qiao, Y Kim, K Lee, Y Nie, D Lee, T Osadchy, RJ Molnar, ... Nature materials 17, 999–1004, 2018 | 226 | 2018 |
| Alloying conducting channels for reliable neuromorphic computing H Yeon, P Lin, C Choi, SH Tan, Y Park, D Lee, J Lee, F Xu, B Gao, H Wu, ... Nature nanotechnology 15 (7), 574-579, 2020 | 192 | 2020 |
| Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors Y Kim, JM Suh, J Shin, Y Liu, H Yeon, K Qiao, HS Kum, C Kim, HE Lee, ... Science 377 (6608), 859-864, 2022 | 102 | 2022 |
| Long-term reliable physical health monitoring by sweat pore–inspired perforated electronic skins H Yeon, H Lee, Y Kim, D Lee, Y Lee, JS Lee, J Shin, C Choi, JH Kang, ... Science Advances 7 (27), eabg8459, 2021 | 92 | 2021 |
| Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence C Choi, H Kim, JH Kang, MK Song, H Yeon, CS Chang, JM Suh, J Shin, ... Nature Electronics 5 (6), 386-393, 2022 | 63 | 2022 |
| Non-epitaxial single-crystal 2D material growth by geometric confinement KS Kim†, D Lee†, CS Chang†, S Seo, Y Hu, S Cha, H Kim, J Shin, JH Lee, ... Nature 614 (7946), 88-94, 2023 | 57 | 2023 |
| Graphene buffer layer on SiC as a release layer for high-quality freestanding semiconductor membranes K Qiao, Y Liu, C Kim, RJ Molnar, T Osadchy, W Li, X Sun, H Li, ... Nano letters 21 (9), 4013-4020, 2021 | 43 | 2021 |
| Role of transferred graphene on atomic interaction of GaAs for remote epitaxy H Kim, JC Kim, Y Jeong, J Yu, K Lu, D Lee, N Kim, HY Jeong, J Kim, ... Journal of Applied Physics 130 (17), 2021 | 27 | 2021 |
| Observation of a flat band and bandgap in millimeter-scale twisted bilayer graphene K Sato, N Hayashi, T Ito, N Masago, M Takamura, M Morimoto, ... Communications Materials 2 (1), 117, 2021 | 16 | 2021 |
| Monolithic 3D integration of 2D materials-based electronics towards ultimate edge computing solutions JH Kang, H Shin, KS Kim, MK Song, D Lee, Y Meng, C Choi, JM Suh, ... Nature Materials 22 (12), 1470-1477, 2023 | 10 | 2023 |
| Remote epitaxial interaction through graphene CS Chang, KS Kim, BI Park, J Choi, H Kim, J Jeong, M Barone, N Parker, ... Science Advances 9 (42), eadj5379, 2023 | 3 | 2023 |
| Junctionless Negative‐Differential‐Resistance Device using 2D Van‐Der‐Waals Layered Materials for Ternary Parallel Computing T Lee, KS Jung, S Seo, J Lee, J Park, S Kang, J Park, J Kang, H Ahn, ... Advanced Materials, 2310015, 2024 | | 2024 |
| Seamless monolithic three-dimensional integration of single-crystalline films by growth KS Kim, S Seo, J Kwon, D Lee, C Kim, JE Ryu, J Kim, MK Song, JM Suh, ... arXiv preprint arXiv:2312.03206, 2023 | | 2023 |
| Layer-by-Layer Single-crystal Two-dimensional Material Growth by Geometric Confinement D Lee Massachusetts Institute of Technology, 2023 | | 2023 |
