Additive Manufacturing of 3D‐Architected Multifunctional Metal Oxides DW Yee, ML Lifson, BW Edwards, JR Greer Advanced Materials 31 (33), 1901345, 2019 | 92 | 2019 |
Enabling Simultaneous Extreme Ultra Low-k in Stiff, Resilient, and Thermally Stable Nano-Architected Materials ML Lifson, MW Kim, JR Greer, BJ Kim Nano letters 17 (12), 7737-7743, 2017 | 32 | 2017 |
Diameter and location control of ZnO nanowires using electrodeposition and sodium citrate ML Lifson, CG Levey, UJ Gibson Applied Physics A 113 (1), 243-247, 2013 | 13 | 2013 |
Integrated circuit heat dissipation using nanostructures AB Botula, ML Lifson, JA Slinkman, TG Van Kessel, RL Wolf US Patent 9,324,628, 2016 | 9 | 2016 |
Apparatus and Method for Centering Substrates on a Chuck SA Adderly, SD Distefano, JP Gambino, MG Levy, ML Lifson, MD Moon, ... US Patent 20,150,235,881, 2015 | 8 | 2015 |
Recoverable Electrical Breakdown Strength and Dielectric Constant in Ultralow-k Nanolattice Capacitors MW Kim, ML Lifson, GA Rebecca, JR Greer, BJ Kim Nano letters 19 (8), 5689-5696, 2019 | 7 | 2019 |
Centering substrates on a chuck SA Adderly, SD DiStefano, JP Gambino, MG Levy, ML Lifson, MD Moon, ... US Patent 10,224,225, 2019 | 7 | 2019 |
METHOD AND APPARATUS FOR DETECTING FOREIGN MATERIAL ON A CHUCK SA Adderly, SD Distefano, JP Gambino, MG Levy, ML Lifson, JH Rankin, ... US Patent 20,150,219,479, 2015 | 6 | 2015 |
Enabling Durable Ultralow‐k capacitors with Enhanced Breakdown Strength in Density‐Variant Nanolattices MW Kim, ML Lifson, R Gallivan, JR Greer, BJ Kim Advanced Materials, 2208409, 2022 | 5 | 2022 |
Integrated circuit heat dissipation using nanostructures AB Botula, ML Lifson, JA Slinkman, TG Van Kessel, RL Wolf US Patent 10,068,827, 2018 | 5 | 2018 |
UNIFORM ROUGHNESS ON BACKSIDE OF A WAFER SA Adderly, JP Gambino, ML Lifson, MD Moon, WJ Murphy, TD Sullivan, ... US Patent 20,150,021,743, 2015 | 5 | 2015 |
Electromechanical Properties of 3D Multifunctional Nano-Architected Materials ML Lifson California Institute of Technology, 2019 | 4 | 2019 |
Integrated circuit heat dissipation using nanostructures AB Botula, ML Lifson, JA Slinkman, TG Van Kessel, RL Wolf US Patent 10,109,553, 2018 | 3 | 2018 |
Integrated circuit heat dissipation using nanostructures AB Botula, ML Lifson, JA Slinkman, TG Van Kessel, RL Wolf US Patent 10,629,710, 2020 | 2 | 2020 |
Integrated circuit heat dissipation using nanostructures AB Botula, ML Lifson, JA Slinkman, TG Van Kessel, RL Wolf US Patent 10,600,893, 2020 | 2 | 2020 |
Integrated circuit heat dissipation using nanostructures AB Botula, ML Lifson, JA Slinkman, TG Van Kessel, RL Wolf US Patent 9,666,701, 2017 | 2 | 2017 |
TSV WAFER WITH IMPROVED FRACTURE STRENGTH JW Adkisson, Y Amoah, JP Gambino, CA Leggett, ML Lifson, CF Musante, ... US Patent 20,150,348,876, 2015 | 2* | 2015 |
TSV WAFER FRACTURE STRENGTH JW Adkisson, Y Amoah, JP Gambino, CA Leggett, ML Lifson, CF Musante, ... US Patent 20,150,255,404, 2015 | 2* | 2015 |
Centering substrates on a chuck SA Adderly, SD DiStefano, JP Gambino, MG Levy, ML Lifson, MD Moon, ... US Patent 9,997,385, 2018 | 1 | 2018 |
The effect of etch residuals on via reliability SA Adderly, MD Moon, ML Lifson, NW Bowe, JP Gambino, TD Sullivan 2013 IEEE Conference on Reliability Science for Advanced Materials and ¡¦, 2013 | 1 | 2013 |