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Bingshou Xiong
Bingshou Xiong
Technical Lead @ Google
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Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength
JHL Pang, TH Low, BS Xiong, X Luhua, CC Neo
Thin solid films 462, 370-375, 2004
2682004
Electromigration induced ductile-to-brittle transition in lead-free solder joints
F Ren, JW Nah, KN Tu, B Xiong, L Xu, JHL Pang
Applied physics letters 89 (14), 2006
1472006
Low cycle fatigue models for lead-free solders
JHL Pang, BS Xiong, TH Low
Thin solid films 462, 408-412, 2004
1472004
Creep and fatigue characterization of lead free 95.5 Sn-3.8 Ag-0.7 Cu solder
JHL Pang, BS Xiong, TH Low
2004 proceedings. 54th electronic components and technology conference (IEEE …, 2004
1462004
Bulk solder and solder joint properties for lead free 95.5 Sn-3.8 Ag-0.7 Cu solder alloy
JHL Pang, BS Xiong, CC Neo, XR Mang, TH Low
53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003
1172003
Low cycle fatigue study of lead free 99.3 Sn–0.7 Cu solder alloy
JHL Pang, BS Xiong, TH Low
International Journal of Fatigue 26 (8), 865-872, 2004
1132004
Mechanical properties for 95.5 Sn–3.8 Ag–0.7 Cu lead-free solder alloy
JHL Pang, BS Xiong
IEEE Transactions on components and packaging Technologies 28 (4), 830-840, 2005
1002005
Modeling stress strain curves for lead-free 95.5 Sn-3.8 Ag-0.7 Cu solder
JHL Pang, BS Xiong, FX Che
5th International Conference on Thermal and Mechanical Simulation and …, 2004
502004
Design for reliability (DFR) methodology for electronic packaging assemblies
JHL Pang, TH Low, BS Xiong, F Che
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC …, 2003
492003
Lead free solder joint reliability characterization for PBGA, PQFP and TSSOP assemblies
FX Che, JHL Pang, BS Xiong, L Xu, TH Low
Proceedings Electronic Components and Technology, 2005. ECTC'05., 916-921, 2005
482005
Ag content effect on mechanical properties of Sn-xAg-0.5 Cu solders
FX Che, EC Poh, WH Zhu, BS Xiong
2007 9th Electronics Packaging Technology Conference, 713-718, 2007
462007
Lead-free 95.5 Sn-3.8 Ag-0.7 Cu solder joint reliability analysis for micro-BGA assembly
JHL Pang, PTH Low, BS Xiong
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2004
322004
Comprehensive mechanics characterization of lead-free 95.5 Sn-3.8 Ag-0.7 Cu solder
JHL Pang, BS Xiong, TH Low
Micromaterials and Nanomaterials 3, 86-93, 2004
312004
Evaluation on influencing factors of board-level drop reliability for chip scale packages (fine-pitch ball grid array)
DYR Chong, FX Che, JHL Pang, L Xu, BS Xiong, HJ Toh, BK Lim
IEEE Transactions on Advanced Packaging 31 (1), 66-75, 2008
272008
Drop reliability performance assessment for PCB assemblies of chip scale packages (CSP)
DYR Chong, HJ Toh, BK Lim, PTH Low, JHL Pang, FX Che, BS Xiong, ...
2005 7th Electronic Packaging Technology Conference 1, 8 pp., 2005
212005
Effect of electromigration on mechanical behavior of solder joints
F Ren, JW Nah, JO Suh, KN Tu, BS Xiong, LH Xu, JHL Pang
Proceedings. International Symposium on Advanced Packaging Materials …, 2005
192005
Warpage improvement for large die flip chip package
B Xiong, MJ Lee, T Kao
2009 11th Electronics Packaging Technology Conference, 40-43, 2009
172009
Microvia reliability improvement for high density interconnect substrate
B Xiong, KW Loo, K Nagarajan
2011 IEEE 13th Electronics Packaging Technology Conference, 138-141, 2011
52011
Mechanics of materials characterization of lead-free solders
B Xiong
32005
In-situ electromigration studies on Sn-Ag-Cu solder joint by digital image speckle analysis (DISA)
L Xu, JHL Pang, BS Xiong
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004 …, 2004
12004
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